Uniform heat for 300mm wafer IR

Thu, 18 Jun 2026 00:44:19 +0800

Watch a 300mm wafer come off the spin coater. The photoresist is sitting there, ready to be set — and if the bake isn’t uniform, you don’t just lose one wafer. You bleed yield and squeeze the thermal budget across the whole lithography cluster. We built our 300mm wafer IR system to fix that, delivering even heat right where it counts. What actually matters under the hood We use short-wave infrared emitters for fast, direct energy transfer. That gives wafer-level temperature uniformity of ±0.1°C across the full 300mm surface, and it holds up cycle after cycle. The platform is compatible with Class 1–100 cleanrooms, and it runs with zero particle events, so the chamber stays clean. Here is why this matters in litho: it directly supports the steps that are most sensitive to heat — soft bake, hard bake, and curing. When uniformity is tight, critical dimension (CD) control stays consistent and defects drop. The thermal response is fast, so cycle time comes down. And the emitters are built to run 5,000+ hours continuously, which means fewer surprises on the floor and less time chasing consumables. What you need to plan for It drops into existing process tracks cleanly, but it does need its own power and coolant. Plan on a 240V, three-phase feed, plus deionized water cooling to keep thermal stability under sustained load. The payoff is simple: repeatable process control, day in and day out.

Heat on Industrial Quartz Heating Systems

Uniform heat for 300mm wafer IR